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SBR0240LPW

Schottky

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Description

Packaged in the X1-DFN1006-2 (SWP) (Type C) package, the SBR0240LPW provides very low VF and excellent reverse-leakage stability at high temperatures. It is ideal for use as a rectifier, freewheel diode, or blocking diode in DC-DC converters and AC-DC adaptors.

Feature(s)

  • Patented Super Barrier Rectifier Technology (SBR®)
  • With Visible and Solderable Side Pads
  • Ultra-Low Forward Voltage Drop
  • Superior Reverse Avalanche Capability
  • Soft, Fast Switching Capability
  • Package with Side Wall Plating
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/
  • An automotive-compliant part is available under separate datasheet (SBR0240LPWQ)

Application(s)

  • DC-DC converters
  • AC-DC adaptors

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

Yes

Configuration

Single

Power Rating(mW)

390 mW

Peak RepetitiveReverse VoltageVRRM (V)

40 V

Forward Continuous Current IFM (mA)

200 mA

Forward VoltageDrop VF(V)

0.59

@ IF(mA)

200 mA

Maximum ReverseCurrent IR (µA)

10 µA

@ VR (V)

40 V

Capacitance CTOT Typ (pF)

8 pF

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2660 2024-03-13 2024-06-13 Qualification of Additional Wafer Source with Wafer Diameter and Mold Compound Changes for Select Discrete Products
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products