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SB1100

1.0A High Voltage Schottky Barrier Rectifier

Datasheet

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Feature(s)

Schottky Barrier Chip
Guard Ring Die Construction for Transient Protection
Ideally Suited for Automatic Assembly
Low Power Loss, High Efficiency
Surge Overload Rating to 25A Peak
For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Application
High Temperature Soldering: 260°C/10 Second at Terminal
Lead Free Finish, RoHS Compliant (Note 3)

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)	Standard
AEC Qualified	No
Configuration	Single
MaximumAverageRectifiedCurrent I_O(A)	1 A
@ TerminalTemperature TT (ºC)	N/A ºC
Peak RepetitiveReverse VoltageV_RRM(V)	100 V
Peak ForwardSurge CurrentI_FSM(A)	25 A
Forward VoltageDrop V_F(V)	0.8 V
@ I_F(A)	1 A
Maximum ReverseCurrent I_R(µA)	500 µA
@ V_R(V)	100 V

Technical Documents

SPICE Model

SB1100.spice.txt

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Purchase & Availablity

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2477	2020-08-17	2021-05-09	Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi