Diodes Incorporated — Analog and discrete power solutions
D FLat A

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. D-FLAT

D FLat A

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. D-FLAT

D FLat A

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. D-FLAT

Back to RS1JDFQ

RS1JDFQ

1.0A SURFACE MOUNT FAST RECOVERY RECTIFIER

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Description

The RS1JDFQ is a rectifier packaged in the low profile D-FLAT package. Providing fast recovery time for high efficiency, this device is ideal for use in general applications.

Feature(s)

  • Glass Passivated Die Construction
  • Fast Recovery Time for High Efficiency
  • Surge Overload Rating to 30A Peak
  • High Current Capability
  • Low Profile Design, Package Height Less than 1.1mm
  • Lead-Free Finish; RoHS Compliant
  • Halogen and Antimony Free. “Green” Device
  • Qualified to AEC-Q101 Standards for High Reliability
  • PPAP Capable

Application(s)

  • Reverse Protection
  • Switching
  • Blocking

Specifications & Technical Documents

Product Parameters

AEC Qualified

Yes

Compliance (Only Automotive Supports PPAP)

Automotive

Product Type

FAST RECOVERY RECTIFIER

Configuration

Single

MaximumAverageRectifiedCurrent IO (A)

1 A

Maximum Peak Forward Surge Current IFSM (A)

30 A

Peak RepetitiveReverse VoltageVRRM (V)

600 V

Forward VoltageDrop VF(V)

1.3 V

@ IF (A)

1 A

Maximum ReverseCurrent IR (µA)

5 µA

@ VR (V)

600 V

Reverse RecoveryTime trr (ns)

250 ns

TotalCapacitance CT (pF)

6 pF

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2702 2024-11-18 2025-02-17 Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Automotive Products
PCN-2619 2023-04-12 2023-07-12 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2500 2021-03-24 2021-06-24 Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for
Automotive Products