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PI49FCT32807

3.3V, 133MHz 1:10 Output Clock Driver with 20-Ohm Output Termination Resistor, Industrial Temperature Operation

NOTE: Datasheet may not yet reflect updated package obsolescence/phase out status or Package Drawing. Please refer to the BUY NOW tab for the most up to date package options and drawings. Please refer to PCN/PDN tabs for most current package obsolescence/phase out status.
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Overview

Product Description

The PI49FCT32807 is a 3.3V very lowskew clock buffer that produces ten outputs from a single low capacitance input. Excellent output signals to power and ground ratio minimize power and ground noise, and also improves output performance. The PI49FCT32807 integrates series damping resistors on all outputs.

Features

  • Low skew: < 200ps
  • Fast switching frequency >133 MHz
  • Fast output rise/fall time < 1.5ns
  • Low propagation delay < 2.5ns
  • Low input capacitance < 6.0pF
  • 5V I/O Tolerant input
  • Rail-to-Rail CMOS outputs
  • Industrial Temperature: –40°C to +85°C
  • 3.3V ±10% operation
  • Packaging (Pb-free & Green Available): 
    • 20-pin 300-mil wide SOIC (S) 
    • 20-pin 150-mil wide QSOP (Q) 
    • 20-pin 209-mil wide SSOP (H)

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

Function

Buffer

Number of Outputs

10

Output Type(s)

CMOS

Maximum Output Frequency (MHz)

133

Additive Jitter (ps)

N/A

Supply Voltage (V)

3.3

Input Type(s)

CMOS

Skew (ps)

200

Ambient or Junction Temperature (°C)

-40 to 85 °C

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2488 2020-10-20 2021-01-20 Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and BOM Change