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PI49FCT32802

3.3V, 133MHz, 1:5 Output Low Skew Clock Driver with 20 Ohm Output Termination Resistor

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Description

The PI49FCT3280x is a 3.3V very low-skew clock buffer from a single low-capacitance input that produces five outputs on PI49FCT32802 and seven outputs on PI49FCT32803. Excellent output signals to power and ground ratio minimize power and ground noise, and also improves output performance. The PI49FCT3280x integrates series damping resistors on all outputs.

Feature(s)

  • Low Skew: <200ps
  • Fast Switching Frequency: 133MHz (Maximum)
  • Fast Output Rise/Fall Time: <1.5ns
  • Low Propagation Delay: <2.5ns
  • Low Input Capacitance: <6.0pF
  • 5V Tolerant Input
  • Rail-to-Rail CMOS Outputs
  • Industrial Temperature: –40°C to +85°C
  • 3V ±10% Operation
  • Packaging (Pb-free & Green available):
    • 16-Pin, 150-mil Wide, QSOP (Q)
    • 16-Pin, 173-mil Wide, TSSOP (L)
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP) Standard
Function Buffer
Number of Outputs 5
Output Type(s) CMOS
Maximum Output Frequency (MHz) 133
Additive Jitter (ps) N/A
Supply Voltage (V) 3.3
Input Type(s) CMOS
Skew (ps) 200
Ambient or Junction Temperature (°C) -40 to 85 °C

Technical Documents

Design Tools

Recommended Soldering Techniques

TN1.pdf

Purchase & Availablity

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2488 2020-10-20 2021-01-20 Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and BOM Change