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PI2DDR3212

DDR3, 14-Channel, Differential 2:1 Mux/DeMux 1.5V or 1.8V

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Product Description

This 14-bit DDR3/DDR4 switch is designed for 1.35V/ 1.5V/ 1.8V supply voltage, POD_12, SSTL_135, SSTL_15 or SSTL_18 signaling and CMOS select input signals. It is designed for DDR3 or DDR4 memory bus with speed up to 5Gbps. It supports DDR3 800 2133Mbps and DDR4 1600~4266 Mbps.

PI2DDR3212 has a 1:2 demux or 2:1 mux topology. All 14-bit channels can be switched to one of the two ports simultaneously with the SEL input. This device also allows all ports to be disconnected.

PI2DDR3212 uses Diodes' proprietary high speed switch technology providing consistent high bandwidth across all channels, with very little insertion loss, cross-talk, and bit to bit skew.

It is available in a 52-pin TQFN 3.5x9mm package and 48-pin TFBGA 4.5x4.5mm package. The 48-pin version is pin compatible with CBTW28DD14.

Features

  • 14 bit 2:1 switch that supports DDR3 800 2133Mbps, DDR4 1600~4266 Mbps
  • VDD 1.35V/ 1.5V/ 1.8V
  • Flow through pinout option for easy layout
  • SEL and Global Enable
  • 110 μA typ. operating current at 1.35V VDD.
  • High impedance and low Coff channel output when disabled or deselected
  • Low RON: 8Ω typical
  • 3dB Bandwidth: 3.3GHz
  • Low insertion loss: -0.7dB (0 ≤ f ≤ 1 GHz)
  • Low return loss: -23dB (0 ≤ f ≤ 1 GHz)
  • Low cross-talk for high speed channels: -25dB typ. (0<f<2GHz)
  • Low off-isolation: -28dB (0 ≤ f ≤ 1 GHz)
  • Low bit-to-bit skew 20ps Max
  • ESD: 2KV HBM
  • POD_12, SSTL_12, SSTL_135, SSTL_15 or SSTL_18 signaling
  • Packaging (Pb-free and Green)
    • 52 pin TQFN (3.5x9mm)
    • 48 pin TFBGA (4.5x4.5mm)pin compatible with CBTW28DD14

Application

  • DDR3/DDR4 Memory Bus System
  • NVDIMM Module
  • Flash Memory Array sub system
  • High Speed multiplexing

Product Specifications

Product Parameters

Configuration Mux: 14 Bit 2 to 1
Differential Channels 0
HotInsertion 0
Lanes N/A
OtherFeatures N/A
RailToRail 0
Signal Type Single Ended
Single Ended Channels N/A
Type SPDT
Voltage 1.35, 1.5, 1.8

Related Content

Packages
TFBGA (NC48) MSL3 BGA
TQFN (ZL52) MSL1 Sn

Applications

Protocols

Technical Documents

Design tool model software

Recommended Soldering Techniques

TN1.pdf

Additional Technical Documents are available upon request: 
Application information, Evaluation board, and Other technical documents

Request Documents
Orderable Part Number Status Package Environmental Compliance Packing Buy from Distributor /
Contact Sales
Request Samples
Qty. Carrier
PI2DDR3212NCE Active TFBGA-48 GREEN 540 TRAY

PI2DDR3212NCE

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Future Electronics - Asia 276 3/4/2021 Singapore Contact Sales
Request Sample
PI2DDR3212NCEX Active TFBGA-48 GREEN 3500 T&R Contact Sales Request Sample
PI2DDR3212ZLEX Active W-QFN3590-52 GREEN 3500 T&R Contact Sales Request Sample

Environmental Compliance Legend:
LFF: Pb-Free Finish and RoHS 5/6
TLFP: Totally Pb-Free Product and RoHS 6/6
LFGP: Pb-free Finish and Green Product, RoHS 5/6 and Halogen Free
TPGP: Totally Pb-Free and Green Product, RoHS 6/6 and Halogen Free
GREEN: Halogen-free and RoHS compliant
RoHS: RoHS compliant but NOT halogen-free

PCNs

Product Change Notices

PCN # Issue Date Implementation Date Subject
PCN-2328 2018-04-12 2018-10-12 Device End of Life for tray packaging only

FAQs

Related Application FAQs

Related Protocol FAQs