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MMBT5401

PNP, 150V, 0.6A, SOT23

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Product Specifications

Product Parameters

Qualified to AEC-Q10x Yes
Compliance (Only Automotive supports PPAP) Yes
Product Type PNP
VCEO, VCES (V) 150 V
IC (A) 0.6 A
ICM (A) N/A A
PD (W) 0.3 W
hFE (min) 60 Min
hFE(@ IC) 0.01 A
hFE(Min 2) 50
hFE(@ IC2) 0.05 A
VCE (SAT)Max (mV) 200 mV
VCE (SAT) (@ IC/IB) (A/m A) 0.01/1
VCE (SAT) (@ IC/IB2) (A/mA) 0.05/5
fT (MHz) 100
VCE (SAT)(Max.2) 500 mV
RCE(SAT) N/A mΩ

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
MMBT5401-7-F

MMBT5401-7-F

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Arrow/Components Agent Ltd. 36000 9/17/2021 Hong Kong Buy Now
RS Components 500 9/17/2021 England Buy Now
RS Components 2250 9/17/2021 England Buy Now
Micronetics GmbH 6000 9/13/2021 Germany Contact Sales
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MMBT5401Q-7-F

MMBT5401Q-7-F

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Arrow Electronics 3000 9/17/2021 United States Buy Now
Mouser Electronics Inc. 456 9/17/2021 South America, North America, Asia, Europe, Middle East Buy Now
Request Sample

PCNs

Product Change Notices

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2462 2020-05-08 2021-04-11 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)