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MMBF170

N-CHANNEL ENHANCEMENT MODE MOSFET

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Product Specifications

Product Parameters

Qualified to AEC-Q10x Yes
Compliance (Only Automotive supports PPAP) Standard
Polarity N
ESD Diodes (Y|N) No
VDS (V) 60 V
VGS (±V) 20 ±V
IDS @TA = +25°C (A) 0.5 A
PD @TA = +25°C (W) 0.3 W
RDS(ON)Max @ VGS(10V)(mΩ) 5000 mΩ
RDS(ON)Max @ VGS(4.5V)(mΩ) 5300 mΩ
VGS (th) Max (V) 3 V

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
MMBF170-7-F

MMBF170-7-F

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Digi-Key Electronics 11 9/19/2021 Europe, Asia, North America Buy Now
RS Components 1550 9/19/2021 England Buy Now
RS Components 82750 9/19/2021 England Buy Now
Future Electronics 666000 9/18/2021 Canada Buy Now
Future Electronics - Asia 63000 9/18/2021 Singapore Contact Sales
Micronetics GmbH 9000 9/13/2021 Germany Contact Sales
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PCNs

Product Change Notices

PCN # Issue Date Implementation Date Subject
PCN-2485 2020-12-04 2021-03-04 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Qualification of Additional Wafer Source for Select Discrete Automotive Products
PCN-2484 2020-11-04 2021-02-04 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Standardization of Assembly Bill of Materials At The Existing CAT Site for Select Discrete Products
PCN-2458 2020-07-01 2020-10-01 Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.