Feature(s)

Low-Forward Voltage Drop
Fast Switching
Very High Density (Five Diode Elements in a Sub-Miniature Package)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Qsuffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)	Standard
AEC Qualified	No
Configuration	Five Element, Common Cathode
Polarity	Anode, Cathode
Power Rating(mW)	500 mW
ESD Diodes (Y\|N)	No
Peak RepetitiveReverse VoltageV_RRM(V)	75 V
Reverse RecoveryTime trr (ns)	4 ns
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω	4
V(BR)R (V) Min @IR=100μA	75
Maximum Average Rectifier Current I_{O (mA)}	200 mA
Maximum Peak Forward Surge Current I_{FSM (A)}	1 A
Forward Voltage Drop V_F @ I_{F (mA)}	1.25 mA
Maximum ReverseCurrent I_R(µA)	1 µA
TotalCapacitance C_T(pF)	2 pF
Maximum Reverse Current I_R @ V_{R (V)}	75 V
VF(V) Max @ IF=1.0mA	0.7
VF(V) Max @ IF=10mA	0.82
IR(uA) Max @ VR=80V	1uA@75V
CT(pF) Max @ VR = 0V, f = 1MHz	2

Technical Documents

SPICE Model

MMBD4148PLM.spice.txt

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2770	2025-10-30	2025-10-30	Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2461	2020-05-08	2021-04-05	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site

MMBD4148PLM