Diodes Incorporated

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

Back to Inactve Datasheet Archive

MMBD3004C (Not Recommended for new design)

NRND = Not Recommended for New Design

switching diode

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) Standard
Configuration Dual, Com. Cath
CT(pF) Max @ VR = 0V, f = 1MHz 5
ESD Diodes (Y|N) No
Forward Voltage Drop VF @ IF (mA) 1.25
IR(uA) Max @ VR=80V 100nA@240V
Maximum Average Rectifier Current IO (mA) 225
Maximum Peak Forward Surge Current IFSM (A) 4
Maximum ReverseCurrent IR (µA) 0.1
Maximum Reverse Current IR @ VR (V) 240
Peak RepetitiveReverse VoltageVRRM (V) 350
Polarity Anode, Cathode
Power Rating(mW) 350
AEC Qualified No
Reverse RecoveryTime trr (ns) 50
TotalCapacitance CT (pF) 5
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω 50
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω 50
V(BR)R (V) Min (µA) 350@150μA
V(BR)R (V) Min @IR=100μA 350@150μA
VF(V) Max @ IF=100mA 1.1

Related Content


Technical Documents


MDS Reports

Recommended Soldering Techniques



Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2607 2023-02-22 2023-08-22 Device End of Life (EOL)
PCN-2592 2022-09-12 2022-12-12 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site Using PdCu Bond Wire and New Lead Frame for Select Products
PCN-2544 2021-10-05 2022-01-05 Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Products
PCN-2315 2018-03-09 2018-06-09 Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility