Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. TO252 (DPAK)
NRND = Not Recommended for New Design
PNP, 100V, 3A, TO252
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| Category | Medium Power Transistor |
|---|---|
| fT (MHz) | N/A |
| fT (MHz) | 3 |
| hFE (min) | 25 |
| hFE(@ IC) | 1 |
| hFE (@ IC) (A) | 1 |
| hFE(@ IC2) | 3 |
| hFE (@ IC2) (A) | 3 |
| hFE(Min 2) | 10 |
| hFE (Min) | 25 |
| IC (A) | 3 |
| IC (A) | 3 |
| ICM (A) | 5 |
| ICM (A) | 5 |
| PD (W) | 2.1 |
| PD (W) | 2.1 |
| Polarity | PNP |
| Product Type | PNP |
| AEC Qualified | Yes |
| RCE(SAT) | N/A |
| VCE (SAT) (@ IC/IB) (A/m A) | N/A |
| VCE (SAT)(Max.2) | N/A |
| VCE (SAT)Max (mV) | 1200 |
| VCE(SAT) (@ IC/IB) (A/mA) | 3, 375 |
| VCE(sat) (@ IC/IB2) (A/mA) | - |
| VCE(sat) (Max.2) (mV) | - |
| VCE(sat) Max (mV) | 1200 |
| VCEO, VCES (V) | 100 |
| VCEO, VCES (V) | 100 |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2644 | 2023-09-27 | 2023-12-27 | Lead Frame Type, Die Bond Process, Wire Bond Type and Mold Compound changes to enhance select TO-252 packaged automotive products |
