The 4-pad FL Series seam seal devices in corporate a sub-miniature AT-cut crystal resonator housed in a standard 3.2 x 2.5mm ceramic package. These compact crystals are ideal for surface mounting in densely populated or small form-factor PCB applications.
| ProductSeries | FL |
|---|---|
| Family | Crystal |
| Legacy PN | NKS3 |
| Freq Range (MHz) | 8 to 66 |
| Package Type | Ceramic Seam |
| Package Size | 3.2 x 2.5 x 0.65 |
| Pads | 4 |
| NotRecommended | 0 |
| PCN # | Issue Date | Subject |
|---|---|---|
| PCN-2380 | 2018-11-07 | Device End of Life (EOL) |
| PCN-2389 | 2019-02-05 | Device End of Life |
| PCN-2269 | 2017-04-21 | Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility |
| PCN-2418 | 2019-11-07 | Device End of Life (EOL) |
| PCN-2315 | 2018-03-09 | Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility |
| PCN-2259 | 2017-02-02 | Qualification of Additional Wafer Sources for Select Discrete Products |
| PCN-2319 | 2018-03-09 | Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility |
| PCN-2391 | 2019-05-24 | Clip Bond Structure, Lead Frame Type, and Mold Compound changes to enhance PowerDI-123 package |
| 10-13 | 2010-11-08 | Adding the PSE Technology (Shandong) Corporation (aka:PSE-SD) located in the hi-tech zone of Jinan, Shandong, China as Pericom qualified manufacturing facility. |
| PCN-2305 | 2018-02-28 | Addition of A Passivation Layer Over The Top Metal of The Die for Selected BJT Devices |
| PCN-2252 | 2017-02-24 | Add Additional Plating Process Site at Diodes Technology (Chengdu) Company Limited (CAT) for Select Parts |
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