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SOT23.pngNRND = Not Recommended for New Design
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| Compliance (Only Automotive supports PPAP) | On Request |
|---|---|
| fT (MHz) | 100 |
| hFE (min) | 300 |
| hFE(@ IC) | 0.5 |
| hFE(@ IC2) | 2 |
| hFE(Min 2) | 150 |
| IC (A) | 2 |
| ICM (A) | 3 |
| PD (W) | 0.6 |
| Product Type | NPN |
| AEC Qualified | Yes |
| RCE(SAT) | N/A |
| VCE (SAT) (@ IC/IB2) (A/m A) (A/m A) | 1/100 |
| VCE (SAT)(Max.2) | 180 |
| VCE (SAT)Max (mV) | 100 |
| VCEO, VCES (V) | 40 |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2495 | 2021-03-31 | 2021-07-01 | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |
| PCN-2305 | 2018-02-28 | 2018-05-28 | Addition of A Passivation Layer Over The Top Metal of The Die for Selected BJT Devices |
