Diodes Incorporated — Analog and discrete power solutions
U DFN2020 6 Type F

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. U-DFN2020-6/SWP (Type F)

U DFN2020 6 Type F

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. U-DFN2020-6/SWP (Type F)

U DFN2020 6 Type F

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. U-DFN2020-6/SWP (Type F)

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DMTH4008LFDFW

40V N-Channel Enhancement Mode MOSFET

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Feature(s)

  • Rated to +175°C – Ideal for High Ambient Temperature Environments
  • 100% Unclamped Inductive Switching, Test in Production – Ensures More Reliable and Robust End Application
  • Low RDS(ON) – Ensures On-State Losses Are Minimized
  • 6mm Profile – Ideal for Low Profile Applications
  • PCB Footprint of 4mm2
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/
  • An automotive-compliant part is available under a separate datasheet (DMTH4008LFDFWQ)

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP) Standard
AEC Qualified Yes
Polarity N
ESD Diodes (Y|N) No
|VDS| (V) 40 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 11.6 A
PD @TA = +25°C (W) 2.35 W
RDS(ON)Max@ VGS(10V)  (mΩ) 11.5 mΩ
RDS(ON)Max@ VGS(4.5V)  (mΩ) 18 mΩ
|VGS(TH)| Max (V) 3 V
QG Typ @ |VGS| = 4.5V (nC) 6.8 nC
QG Typ @ |VGS| = 10V (nC) 14.2 nC
CISS Typ (pF) 1030 pF
CISS Condition @|VDS| (V) 20 V

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availablity

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products