Diodes Incorporated
PowerDI3333 8

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DMTH3004LFGQ

30V 175°C N-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This new generation N-Channel Enhancement Mode MOSFET is designed to minimize RDS(ON), yet maintain superior switching performance. This device is ideal for use in notebook battery power management and loadswitch.

Feature(s)

  • Rated to +175°C – Ideal for High Ambient Temperature Environments
  • 100% Unclamped Inductive Switching (Test in Production) – Ensures More Reliable and Robust End Application
  • Low RDS(ON) – Ensures On-State Losses are Minimized
  • Excellent Qgd x RDS(ON) Product (FOM)
  • Small Form Factor Thermally Efficient Package Enables Higher Density End Products
  • Occupies just 33% of the Board Area Occupied by SO-8 Enabling Smaller End Product
  • 100% UIS (Avalanche) Rated
  • Totally Lead-Free & Fully RoHS Compliant
  • Halogen and Antimony Free. “Green” Device
  • Qualified to AEC-Q101 Standards for High Reliability
  • PPAP Capable

Application(s)

  • Engine Management Systems
  • Body Control Electronics
  • DC-DC Converters

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Automotive
Polarity N
ESD Diodes (Y|N) No
|VDS| (V) 30 V
|VGS| (±V) 16 ±V
|IDS| @TA = +25°C (A) 15 A
|IDS| @TC = +25°C (A) 75 A
PD @TA = +25°C (W) 2.5 W
PD @TC = +25°C (W) 50 W
RDS(ON)Max@ VGS(10V)(mΩ) 5.5 mΩ
RDS(ON)Max@ VGS(4.5V)(mΩ) 8.5 mΩ
|VGS(TH)| Max (V) 3 V
QG Typ @ |VGS| = 4.5V (nC) 20 nC
QG Typ @ |VGS| = 10V (nC) 44 nC
CISS Typ (pF) 2370 pF
CISS Condition @|VDS| (V) 15 V

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2522 2021-08-24 2021-11-24 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly/Test Site Using PdCu or Cu Bond Wire with Standardization of Assembly Bill of Materials for Select Automotive Products