Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. PowerDI3333-8
60V N-Channel Enhancement Mode MOSFET
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This MOSFET is designed to minimize the on-state resistance (RDS(ON)), yet maintain superior switching performance, making it ideal for high-efficiency power management applications.
| Compliance (Only Automotive Supports PPAP) | Standard |
|---|---|
| AEC Qualified | Yes |
| Polarity | N |
| ESD Diodes (Y|N) | No |
| |VDS| (V) | 60 V |
| |VGS| (±V) | 20 ±V |
| |IDS| @TA = +25°C (A) | 15 A |
| |IDS| @TC = +25°C (A) | 80 A |
| PD @TA = +25°C (W) | 2.2 W |
| PD @TC = +25°C (W) | 2 W |
| RDS(ON)Max@ VGS(10V) (mΩ) | 6 mΩ |
| RDS(ON)Max@ VGS(4.5V) (mΩ) | 8.5 mΩ |
| |VGS(TH)| Max (V) | 2 V |
| QG Typ @ |VGS| = 4.5V (nC) | 19.3 nC |
| QG Typ @ |VGS| = 10V (nC) | 41.3 nC |
| CISS Typ (pF) | 2090 pF |
| CISS Condition @|VDS| (V) | 30 V |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2628 | 2023-05-11 | 2023-08-11 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Select Discrete Products |
| PCN-2495 | 2021-03-31 | 2021-07-01 | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |
