Diodes Incorporated
PowerDI3333 8

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DMT3003LFG

30V N-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This MOSFET is designed to minimize the on-state resistance (RDS(ON)), yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Feature(s)

  • Low RDS(ON) – Ensures On-State Losses are Minimized
  • Excellent QGD × RDS(ON) Product (FOM)
  • Advanced Technology for DC-DC Converts
  • Small Form Factor Thermally Efficient Package Enables Higher Density End Products
  • Occupies Just 33% of the Board Area Occupied by SO-8 Enabling Smaller End Product
  • 100% UIS (Avalanche) Rated
  • Lead-Free Finish; RoHS Compliant

Application(s)

  • Backlighting
  • Power Management Functions
  • DC-DC Converters

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity N
ESD Diodes (Y|N) No
|VDS| (V) 30 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 22 A
|IDS| @TC = +25°C (A) 100 A
PD @TA = +25°C (W) 2.4 W
PD @TC = +25°C (W) 62 W
RDS(ON)Max@ VGS(10V)(mΩ) 3.2 mΩ
RDS(ON)Max@ VGS(4.5V)(mΩ) 5.5 mΩ
|VGS(TH)| Max (V) 3 V
QG Typ @ |VGS| = 4.5V (nC) 20 nC
QG Typ @ |VGS| = 10V (nC) 44 nC
CISS Typ (pF) 2370 pF
CISS Condition @|VDS| (V) 15 V

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2628 2023-05-11 2023-08-11 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Select Discrete Products
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2403 2019-03-25 2019-06-19 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products.

FAQs

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