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DMT3002LPS

30V N-Channel Enhancement Mode MOSFET

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Description

This new generation N-Channel Enhancement Mode MOSFET is designed to minimize RDS(ON), yet maintain superior switching performance. This device is ideal for use in power management and load switch.

Feature(s)

  • Thermally Efficient Package – Cooler Running Applications
  • <1.1mm Package Profile – Ideal for Thin Applications
  • High Conversion Efficiency
  • Low RDS(ON) – Minimizes On-State Losses
  • Low Input Capacitance
  • Fast Switching Speed

Application(s)

  • DC-DC Converters
  • Load Switch

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

Yes

Polarity

N

ESD Diodes (Y|N)

No

|VDS| (V)

30 V

|VGS| (±V)

16 ±V

|IDS| @TC = +25°C (A)

240 A

PD @TA = +25°C (W)

2.5 W

PD @TC = +25°C (W)

136 W

RDS(ON)Max@ VGS(10V)  (mΩ)

1.6 mΩ

RDS(ON)Max@ VGS(4.5V)  (mΩ)

2.5 mΩ

|VGS(TH)| Max (V)

2 V

QG Typ @ |VGS| = 4.5V (nC)

37 nC

QG Typ @ |VGS| = 10V (nC)

77 nC

CISS Typ (pF)

5000 pF

CISS Condition @|VDS| (V)

15 V

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2628 2023-05-11 2023-08-11 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Select Discrete Products