Diodes Incorporated
PowerDI3333 8

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

PowerDI3333-8.png
Back to MOSFET Master Table

DMT10H009LFG

100V N-CHANNEL ENHANCEMENT MODE MOSFET

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Description

This MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high-efficiency power management applications.

Feature(s)

  • Low RDS(ON) – Ensures On State Losses are Minimized
  • Excellent Qgd x RDS (ON) Product (FOM)
  • Advanced Technology for DC/DC Converters
  • Small Form Factor Thermally Efficient Package Enables Higher Density End Products
  • Occupies Just 33% of the Board Area Occupied by SO-8 Enabling Smaller End Product
  • 100% Unclamped Inductive Switching (UIS) Test in Production - Ensures More Reliable and Robust End Application
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)

Application(s)

  • Synchronous Rectifier
  • Backlighting
  • Power Management Functions
  • DC-DC Converters

Product Specifications

Product Parameters

AEC Qualified No
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity N
ESD Diodes (Y|N) No
|VDS| (V) 100 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 13 A
|IDS| @TC = +25°C (A) 50 A
PD @TA = +25°C (W) 2 W
PD @TC = +25°C (W) 30 W
RDS(ON)Max@ VGS(10V)(mΩ) 8.5 mΩ
RDS(ON)Max@ VGS(4.5V)(mΩ) 12.5 mΩ
|VGS(TH)| Max (V) 2.5 V
QG Typ @ |VGS| = 10V (nC) 41 nC
CISS Typ (pF) 2361 pF
CISS Condition @|VDS| (V) 50 V

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2628 2023-05-11 2023-08-11 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Select Discrete Products
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.