Diodes Incorporated
PowerDI3333 8

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PowerDI3333-8.png
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DMS3014SFGQ

30V N-CHANNEL ENHANCEMENT MODE MOSFET

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Features and Benefits

  • - DIOFET utilizes a unique patented process to monolithically integrate a MOSFET and a Schottky in a single die to deliver:

- Low RDS(ON) – minimize conduction losses
- Low VSD – reducing the losses due to body diode conduction
- Low QRR – lower QRR of the integrated Schottky reduces body diode switching losses
- Low gate capacitance (Qg/Qgs) ratio – reduces risk of shootthrough or cross conduction currents at high frequencies

  •  Small form factor thermally efficient package enables higher density end products
  • Occupies just 33% of the board area occupied by SO-8 enabling smaller end product
  • 100% UIS (Avalanche) Rated
  • 100% Rg Tested
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • Qualified to AEC-Q101 Standards for High Reliability
  • PPAP Capable (Note 4)

Description and Application

This MOSFET is designed to meet the stringent requirements of
Automotive applications. It is qualified to AEC-Q101, supported by a
PPAP and is ideal for use in:

  •  Backlighting
  • Power Management Functions
  • DC-DC Converters

Mechanical Data

  • Case: PowerDI®3333-8
  • Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminal Connections Indicator: See Diagram
  • Terminals: Finish  Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208
  • Weight: 0.072 grams (Approximate)

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Automotive
Polarity N
ESD Diodes (Y|N) No
|VDS| (V) 30 V
|VGS| (±V) 12 ±V
|IDS| @TA = +25°C (A) 9 A
PD @TA = +25°C (W) 2.1 W
RDS(ON)Max@ VGS(10V)(mΩ) 14.5 mΩ
RDS(ON)Max@ VGS(4.5V)(mΩ) 15.5 mΩ
|VGS(TH)| Max (V) 2.2 V
QG Typ @ |VGS| = 4.5V (nC) 19.3 nC
QG Typ @ |VGS| = 10V (nC) 45.7 nC
CISS Typ (pF) 2296 pF
CISS Condition @|VDS| (V) 15 V

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2522 2021-08-24 2021-11-24 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly/Test Site Using PdCu or Cu Bond Wire with Standardization of Assembly Bill of Materials for Select Automotive Products