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DMP3099L

P-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This MOSFET has been designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Application(s)

  • Backlighting
  • Power Management Functions
  • DC-DC Converters
  • Product Specifications

    Product Parameters

    Qualified to AEC-Q10x Yes
    Compliance (Only Automotive supports PPAP) Standard
    Polarity P
    ESD Diodes (Y|N) No
    VDS (V) 30 V
    VGS (±V) 20 ±V
    IDS @TA = +25°C (A) 3.8 A
    PD @TA = +25°C (W) 1.08 W
    RDS(ON)Max @ VGS(10V)(mΩ) 65 mΩ
    RDS(ON)Max @ VGS(4.5V)(mΩ) 99 mΩ
    VGS (th) Max (V) 2.1 V
    QG Typ @ VGS = 4.5V (nC) 5.2 nC
    QG Typ@ VGS = 10V(nC) 11 nC

    Related Content

    Packages

    Technical Documents

    SPICE Model

    Recommended Soldering Techniques

    TN1.pdf

    RoHS CofC

    Orderable Part Number Buy from Distributor / Contact Sales Request Samples
    DMP3099L-7

    DMP3099L-7

    Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
    RS Components 20500 9/19/2021 England Buy Now
    RS Components 32200 9/19/2021 England Buy Now
    Request Sample
    DMP3099LQ-7

    DMP3099LQ-7

    Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
    Micronetics GmbH 3000 9/13/2021 Germany Contact Sales
    Request Sample

    PCNs

    Product Change Notices

    PCN # Issue Date Implementation Date Subject
    PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
    Source for Select Discrete Products
    PCN-2458 2020-07-01 2020-10-01 Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
    PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
    Additional Wafer Source for Select Products.