Diodes Incorporated — Analog and discrete power solutions
PowerDI3333 8

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. PowerDI3333-8

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DMP3017SFGQ (NRND)

NRND = Not Recommended for New Design

30V P-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This new generation MOSFET is designed to minimize the on-state resistance (RDS(ON)), yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Feature(s)

  • Low RDS(ON) – ensures on state losses are minimized
  • Small form factor thermally efficient package enables higher density end products
  • Occupies just 33% of the board area occupied by SO-8 enabling smaller end product
  • ESD Protected Gate

Application(s)

  • Backlighting
  • Power Management Functions
  • DC-DC Converters
  • Automotive
  • Communications

Specifications & Technical Documents

Product Parameters

CISS Condition @|VDS| (V)

15

CISS Typ (pF)

2246

Configuration

Single

ESD Diodes (Y|N)

Yes

Polarity

P

QG Typ @ |VGS| = 10V (nC)

41

QG Typ @ |VGS| = 4.5V (nC)

20.5 (@5V)

AEC Qualified

Yes

RDS(ON)Max@ VGS(10V)  (mΩ)

10

RDS(ON)Max@ VGS(4.5V)  (mΩ)

18

|VDS| (V)

30

|VGS| (±V)

25

|VGS(TH)| Max (V)

3

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2533 2021-09-02 2022-03-02 Device End of Life (EOL)
PCN-2522 2021-08-24 2021-11-24 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly/Test Site Using PdCu or Cu Bond Wire with Standardization of Assembly Bill of Materials for Select Automotive Products