Diodes Incorporated — Analog and discrete power solutions
TSOT26

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. TSOT26

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DMP2035UVTQ

P-Channel Enhancement Mode MOSFET

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Description

This new generation MOSFET has been designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Feature(s)

• Low Input Capacitance
• Low On-Resistance
• Fast Switching Speed
• ESD protected Up To 3KV
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
• PPAP Capable (Note 4)

Application(s)

• DC-DC Converters
• Motor Control
• Power management functions
• Analog Switch

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Automotive

AEC Qualified

Yes

Polarity

P

ESD Diodes (Y|N)

Yes

|VDS| (V)

20 V

|VGS| (±V)

12 ±V

|IDS| @TA = +25°C (A)

6 A

PD @TA = +25°C (W)

2 W

RDS(ON)Max@ VGS(4.5V)  (mΩ)

35 mΩ

RDS(ON)Max@ VGS(2.5V)  (mΩ)

45 mΩ

RDS(ON)Max@ VGS(1.8V)  (mΩ)

62 mΩ

|VGS(TH)| Min (V)

0.4 V

|VGS(TH)| Max (V)

1.5 V

QG Typ @ |VGS| = 4.5V (nC)

15.4 nC

CISS Typ (pF)

1610 pF

CISS Condition @|VDS| (V)

10 V

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2457 2020-05-27 2020-08-27 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, and Change to Palladium Coated Copper Bond Wire, and New Mold Compound on Select Automotive Products