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DMP2035U

P-CHANNEL ENHANCEMENT MODE MOSFET

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Product Specifications

Product Parameters

Qualified to AEC-Q10x Yes
Compliance (Only Automotive supports PPAP) On Request
Polarity P
ESD Diodes (Y|N) Yes
VDS (V) 20 V
VGS (±V) 10 ±V
IDS @TA = +25°C (A) 4.9 A
PD @TA = +25°C (W) 1.2 W
RDS(ON)Max @ VGS(4.5V)(mΩ) 35 mΩ
RDS(ON)Max @ VGS(2.5V)(mΩ) 45 mΩ
RDS(ON)Max @ VGS(1.8V)(mΩ) 62 mΩ
VGS (th) Max (V) 1 V
QG Typ @ VGS = 4.5V (nC) 15.4 nC

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
DMP2035U-7

DMP2035U-7

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
RS Components 350 9/21/2021 England Buy Now
RS Components 1250 9/21/2021 England Buy Now
Request Sample
DMP2035UFCL-7

DMP2035UFCL-7

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Mouser Electronics Inc. 3000 9/22/2021 South America, North America, Asia, Europe, Middle East Buy Now
Digi-Key Electronics 1712 9/21/2021 Europe, Asia, North America Buy Now
Request Sample
DMP2035UFDF-7

DMP2035UFDF-7

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Farnell, An Avnet Company 20 9/22/2021 England Buy Now
Request Sample
DMP2035UTS-13

DMP2035UTS-13

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Arrow Electronics 220 9/22/2021 United States Buy Now
Arrow Electronics Central EU 2500 9/22/2021 Europe Buy Now
Digi-Key Electronics 2429 9/21/2021 Europe, Asia, North America Buy Now
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PCNs

Product Change Notices

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2458 2020-07-01 2020-10-01 Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2457 2020-05-27 2020-08-27 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, and Change to Palladium Coated Copper Bond Wire, and New Mold Compound on Select Automotive Products
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.
PCN-2402 2019-05-15 2019-08-15 Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site and Conversion to Palladium Coated Copper Bond Wire with New Lead Frame Type on Select Products
PCN-2374 2018-12-07 2019-03-07 Qualification of "Diodes Technology (Cheng Du) Company Limited"
(CAT) as an Additional Assembly & Test Site, Conversion to Palladium Coated Copper Bond Wire with New Molding Compound, and Qualification of Alternative Die Source on Select Products