Diodes Incorporated — Analog and discrete power solutions
Back to DMP10H400SE

DMP10H400SE

P-Channel Enhancement Mode MOSFET

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Description

This MOSFET is designed to minimize the on-state resistance and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Feature(s)

  • Low Input Capacitance
  • Low Gate Drive
  • Fast Switching Speed

Application(s)

  • DC-DC Converters
  • Power management functions
  • Motor Control

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

Yes

Polarity

P

ESD Diodes (Y|N)

No

|VDS| (V)

100 V

|VGS| (±V)

20 ±V

|IDS| @TA = +25°C (A)

2.3 A

PD @TA = +25°C (W)

2 W

RDS(ON)Max@ VGS(10V)  (mΩ)

250 mΩ

RDS(ON)Max@ VGS(4.5V)  (mΩ)

300 mΩ

|VGS(TH)| Max (V)

3 V

QG Typ @ |VGS| = 4.5V (nC)

8.4 nC

QG Typ @ |VGS| = 10V (nC)

17.5 nC

CISS Typ (pF)

1239 max @ 25V pF

CISS Condition @|VDS| (V)

25 V

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

Something went wrong with your request. Please try again later. If this problem continues, please contact Diodes support for assistance.

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2638 2023-09-19 2023-12-19 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site with Standardization of Assembly Bill of Materials at CAT for Select Discrete Products
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products