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U WLB1515 9

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. U-WLB1515-9

U WLB1515 9

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. U-WLB1515-9

U WLB1515 9

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. U-WLB1515-9

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DMP1008UCB9

P-Channel Enhancement Mode MOSFET

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Description

This 3rd generation Lateral MOSFET (LD-MOS) is engineered to minimize on-state losses and switch ultra-fast, making it ideal for high efficiency power transfer. It uses Chip-Scale Package (CSP) to increase power density by combining low thermal impedance with minimal RDS(ON) per footprint area.

Feature(s)

  • LD-MOS Technology with the Lowest Figure of Merit:
  • RDS(ON) = 5.7mΩ to Minimize On-State Losses
  • Qg = 8.2nC for Ultra-Fast Switching
  • VGS(TH) = -0.6V Typ. for a Low Turn-On Potential
  • CSP with Footprint 1.5mm  1.5mm
  • Height = 0.60mm for Low Profile
  • ESD Protection of Gate
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/

Application(s)

  • DC-DC Converters
  • Battery Management
  • Load Switch

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

No

Polarity

P

ESD Diodes (Y|N)

Yes

|VDS| (V)

8 V

|VGS| (±V)

6 ±V

|IDS| @TA = +25°C (A)

13.2 A

PD @TA = +25°C (W)

1.53 W

RDS(ON)Max@ VGS(4.5V)  (mΩ)

5.7 mΩ

RDS(ON)Max@ VGS(2.5V)  (mΩ)

9.1 mΩ

|VGS(TH)| Min (V)

0.4 V

|VGS(TH)| Max (V)

1.1 V

QG Typ @ |VGS| = 4.5V (nC)

8.2 nC

CISS Typ (pF)

900 pF

CISS Condition @|VDS| (V)

4 V

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availability

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