Diodes Incorporated
PowerDI3333 8

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

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DMN3018SFGQ (Not Recommended for new design)

NRND = Not Recommended for New Design


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This MOSFET is designed to meet the stringent requirements of automotive applications. It is qualified to AECQ101 and supported by a PPAP.


  • Low RDS(ON) – ensures on state losses are minimized
  • Small form factor thermally efficient package enables higher density end products
  • Occupies just 33% of the board area occupied by SO-8 enabling smaller end product


  • Backlighting
  • Power Management Functions
  • DC-DC Converters

Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) Automotive
CISS Condition @|VDS| (V) 15
CISS Typ (pF) 697
Compliance (Only Automotive(Q) supports PPAP) Automotive
Configuration Single
ESD Diodes (Y|N) Yes
|IDS| @TA = +25°C (A) 8.5
PD @TA = +25°C (W) 2.2
Polarity N
Compliance (Only Automotive supports PPAP) Automotive (Q)
QG Typ @ |VGS| = 10V (nC) 13.2
QG Typ @ |VGS| = 4.5V (nC) 6
QG Typ @ VGS = 5V(nC) N/A
AEC Qualified Yes
RDS(ON)Max@ VGS(10V)(mΩ) 21
RDS(ON)Max@ VGS(4.5V)(mΩ) 35
|VDS| (V) 30
|VGS| (±V) 25
|VGS(TH)| Max (V) 2.1

Related Content


Technical Documents


Recommended Soldering Techniques


Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2522 2021-08-24 2021-11-24 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly/Test Site Using PdCu or Cu Bond Wire with Standardization of Assembly Bill of Materials for Select Automotive Products