Diodes Incorporated
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DMN1054UCB4

N-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This 3rd generation Lateral MOSFET (LD-MOS) is engineered to minimize on-state losses and switch ultra-fast, making it ideal for high efficiency power transfer. It uses Chip-Scale Package (CSP) to increase power density by combining low thermal impedance with minimal RDS(on) per footprint area.

Feature(s)

  •  LD-MOS Technology with the Lowest Figure of Merit:
         RDS(on) = 37mΩ to Minimize On-State Losses
         Qg = 7.5nC for Ultra-Fast Switching
  • Vgs(th) = 0.6V typ. for a Low Turn-On Potential
  • CSP with Footprint 0.8mm × 0.8mm
  • Height = 0.35mm for Low Profile

Application(s)

  • DC-DC Converters
  • Battery Management
  • Load Switch

Product Specifications

Product Parameters

AEC Qualified No
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity N
ESD Diodes (Y|N) No
|VDS| (V) 8 V
|VGS| (±V) 5 ±V
|IDS| @TA = +25°C (A) 4 A
PD @TA = +25°C (W) 1.34 W
RDS(ON)Max@ VGS(4.5V)(mΩ) 42 mΩ
RDS(ON)Max@ VGS(2.5V)(mΩ) 50 mΩ
RDS(ON)Max@ VGS(1.8V)(mΩ) 65 mΩ
|VGS(TH)| Max (V) 0.7 V
QG Typ @ |VGS| = 4.5V (nC) 9.6 nC
CISS Typ (pF) 590 pF
CISS Condition @|VDS| (V) 6 V

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf