Diodes Incorporated — Analog and discrete power solutions
SO 8

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SO-8

SO 8

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SO-8

SO 8

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SO-8

Back to DMHC3025LSD

DMHC3025LSD

30V Complementary Enhancement Mode MOSFET H-Bridge

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Description

This new generation complementary MOSFET H-Bridge features low on-resistance achievable with low gate drive.

Feature(s)

  • 2 x N + 2 x P channels in a SOIC package
  • Low On-Resistance
  • Low Input Capacitance
  • Fast Switching Speed
  • Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • Qualified to AEC-Q101 Standards for High Reliability

Application(s)

  • DC Motor control
  • DC-AC Inverters

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

Yes

Polarity

2N2P

ESD Diodes (Y|N)

No

|VDS| (V)

30 V

|VGS| (±V)

20 ±V

|IDS| @TA = +25°C (A)

6, 4.2 A

PD @TA = +25°C (W)

1.5 W

RDS(ON)Max@ VGS(10V)  (mΩ)

25, 50 mΩ

RDS(ON)Max@ VGS(4.5V)  (mΩ)

40, 80 mΩ

|VGS(TH)| Min (V)

1, 1 V

|VGS(TH)| Max (V)

2, 2 V

QG Typ @ |VGS| = 10V (nC)

11.7, 11.4 nC

CISS Typ (pF)

590, 631 pF

CISS Condition @|VDS| (V)

15, 15 V

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availability

Something went wrong with your request. Please try again later. If this problem continues, please contact Diodes support for assistance.

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products