Diodes Incorporated
PowerDi5060 8 Type C

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DMC1015UPD

COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET

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Description

This new generation complementary pair enhancement mode MOSFET has been designed to minimize RDS(ON) yet maintain superior switching performance. This device is ideal for use in notebook battery power management and load switch.  

Feature(s)

  • Thermally Efficient Package – Cooler Running Applications
  • High Conversion Efficiency
  • Low RDS(ON) – Minimizes On-State Losses
  • Low Input Capacitance
  • Fast Switching Speed
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Application(s)

  • Notebook battery power management
  • DC-DC converters
  • Load switches

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity N+P
ESD Diodes (Y|N) No
|VDS| (V) 12, 20 V
|VGS| (±V) 8, 8 ±V
|IDS| @TA = +25°C (A) 9.5, 6.8
PD @TA = +25°C (W) 2.3
RDS(ON)Max@ VGS(4.5V)(mΩ) 17, 35 mΩ
RDS(ON)Max@ VGS(2.5V)(mΩ) 25, 55 mΩ
|VGS(TH)| Min (V) 0.6, 0.6 V
|VGS(TH)| Max (V) 1.5, 1.5 V
QG Typ @ |VGS| = 4.5V (nC) 15.6, 15.4 nC
CISS Typ (pF) 1495, 1745 pF
CISS Condition @|VDS| (V) 6, 10 V

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2439 2019-12-05 2020-03-05 Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Using Gold
Bond Wire, and as an Additional Wafer Back Grinding and Back Metal Process Source on Select MOSFET Products

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