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DLLFSD01LPH4

ULTRA LOW LEAKAGE SURFACE MOUNT FAST SWITCHING DIODE

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Description

Ultra low leakage fast switching diodes in an ultra small, low profile leadless surface mount package

Application

Mobile phones, battery-powered portable electronics

Features

  • Fast Switching Speed, fast reverse recovery time.
  • Ultra-Low Reverse Leakage Current (~5nA @VR = 5V)
  • Very Low Capacitance (<1pF @ VR = 0V)

Product Specifications

Product Parameters

Qualified to AECQ10x No
Automotive Compliant PPAP No
Configuration Single
Polarity Unidirectional
Power Rating 350 mW
ESD Diodes No Y/N
Peak Repetitive Reverse Voltage VRRM 80 V
Reverse Recovery Time trr 4 ns
Maximum Average Rectifier Current IO 100 mA
Maximum Peak Forward Surge Current IFSM 2 A
Forward Voltage Drop VF @ IF 0.62, 0.74, 0.94 mA
Maximum Reverse Current IR 0.01, 0.1, 0.2 µA
Maximum Reverse Current IR @ VR 80 V
V(BR)R (V) Min @IR=100μA 80
Total Capacitance CT 0.5 pF
VF(V) Max @ IF=1.0mA N/A
VF(V) Max @ IF=10mA 0.855
VF(V) Max @ IF=100mA 1
IR(nA) Max @ VR=5V N/A
IR(uA) Max @ VR=30V N/A
IR(uA) Max @ VR=80V 0.2
CT(pF) Max @ VR = 0V, f = 1MHz 2.5
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω 4

Related Content

Packages
X2-DFN1006-2

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Orderable Part Number Authorized Distributor Quantity Inventory Date Buy Online Region
DLLFSD01LPH4-7B Digi-Key Electronics 6784 8/8/2020 Buy Now United States
DLLFSD01LPH4-7B Mouser Electronics Inc. 15747 8/8/2020 Buy Now United States

PCNs

Product Change Notices

PCN # Issue Date Subject
PCN-2461 2020-05-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2315 2018-03-09 Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility