Diodes Incorporated
X3 DFN0603 2

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DLLFSD01LP3

ULTRA LOW LEAKAGE SURFACE MOUNT FAST SWITCHING DIODE

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Description

  • Case: X3-DFN0603-2
  • Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminal Connections: Cathode Bar
  • Terminals: Finish — Matte Tin Finish over Copper Leadframe
  • (Lead-Free Plating). Solderable per MIL-STD-202, Method 208
  • Weight: 0.0002 grams (Approximate)

Feature(s)

  • Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm)
  • Ultra-Low Profile Package (0.3mm)
  • Fast Switching Speed, Fast Reverse Recovery Time
  • Ultra-Low Reverse Leakage Current (~ 5nA @ VR = 5V)
  • Very Low Capacitance (<1pF @ VR=0V)
  • Totally Lead-Free & Fully RoHS Compliant 
  • Halogen and Antimony Free. “Green” Device 

Product Specifications

Product Parameters

AEC Qualified No
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
Polarity Anode, Cathode
Power Rating(mW) 200 mW
ESD Diodes (Y|N) No
Peak RepetitiveReverse VoltageVRRM (V) 80 V
Reverse RecoveryTime trr (ns) 4 ns
Maximum Average Rectifier Current IO (mA) 100 mA
Maximum Peak Forward Surge Current IFSM (A) 2 A
Forward Voltage Drop VF @ IF (mA) 100, 0.94 mA
Maximum ReverseCurrent IR (µA) 0.01 µA
TotalCapacitance CT (pF) 0.5 pF
VF(V) Max @ IF=100mA 1
V(BR)R (V) Min @IR=100μA 80
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω 4
Maximum Reverse Current IR @ VR (V) 80 V
VF(V) Max @ IF=10mA 0.855
IR(uA) Max @ VR=80V 0.2
CT(pF) Max @ VR = 0V, f = 1MHz 2.5

Related Content

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Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2315 2018-03-09 2018-06-09 Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility

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