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DLLFSD01LP3

ULTRA LOW LEAKAGE SURFACE MOUNT FAST SWITCHING DIODE

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Description

  • Case: X3-DFN0603-2
  • Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminal Connections: Cathode Bar
  • Terminals: Finish — Matte Tin Finish over Copper Leadframe
  • (Lead-Free Plating). Solderable per MIL-STD-202, Method 208
  • Weight: 0.0002 grams (Approximate)

Features

  • Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm)
  • Ultra-Low Profile Package (0.3mm)
  • Fast Switching Speed, Fast Reverse Recovery Time
  • Ultra-Low Reverse Leakage Current (~ 5nA @ VR = 5V)
  • Very Low Capacitance (<1pF @ VR=0V)
  • Totally Lead-Free & Fully RoHS Compliant 
  • Halogen and Antimony Free. “Green” Device 

Product Specifications

Product Parameters

Qualified to AECQ10x No
Automotive Compliant PPAP No
Configuration Single
Polarity Anode, Cathode
Power Rating 200 mW
ESD Diodes No Y/N
Peak Repetitive Reverse Voltage VRRM 80 V
Reverse Recovery Time trr 4 ns
Maximum Average Rectifier Current IO 100 mA
Maximum Peak Forward Surge Current IFSM 2 A
Forward Voltage Drop VF @ IF 100, 0.94 mA
Maximum Reverse Current IR 0.01 µA
Maximum Reverse Current IR @ VR 80 V
V(BR)R (V) Min @IR=100μA 80
Total Capacitance CT 0.5 pF
VF(V) Max @ IF=1.0mA N/A
VF(V) Max @ IF=10mA 0.855
VF(V) Max @ IF=100mA 1
IR(nA) Max @ VR=5V N/A
IR(uA) Max @ VR=30V N/A
IR(uA) Max @ VR=80V 0.2
CT(pF) Max @ VR = 0V, f = 1MHz 2.5
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω 4

Related Content

Packages
X3-DFN0603-2

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Orderable Part Number Authorized Distributor Quantity Inventory Date Buy Online Region
DLLFSD01LP3-7 Avnet EU 10000 8/8/2020 Buy Now Germany
DLLFSD01LP3-7 Arrow Electronics 30000 8/8/2020 Buy Now United States
DLLFSD01LP3-7 Digi-Key Electronics 4847 8/8/2020 Buy Now United States
DLLFSD01LP3-7 Mouser Electronics Inc. 20033 8/8/2020 Buy Now United States

PCNs

Product Change Notices

PCN # Issue Date Subject
PCN-2315 2018-03-09 Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility
PCN-2461 2020-05-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site

FAQs

Related Application FAQs