Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. X3-DFN0603-2

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DLLFSD01LP3

ULTRA LOW LEAKAGE SURFACE MOUNT FAST SWITCHING DIODE

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Description

Case: X3-DFN0603-2
Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: Cathode Bar
Terminals: Finish — Matte Tin Finish over Copper Leadframe
(Lead-Free Plating). Solderable per MIL-STD-202, Method 208
Weight: 0.0002 grams (Approximate)

Feature(s)

Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm)
Ultra-Low Profile Package (0.3mm)
Fast Switching Speed, Fast Reverse Recovery Time
Ultra-Low Reverse Leakage Current (~ 5nA @ VR = 5V)
Very Low Capacitance (<1pF @ VR=0V)
Totally Lead-Free & Fully RoHS Compliant
Halogen and Antimony Free. “Green” Device

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)	Standard
AEC Qualified	No
Configuration	Single
Polarity	Anode, Cathode
Power Rating(mW)	200 mW
ESD Diodes (Y\|N)	No
Peak RepetitiveReverse VoltageV_RRM(V)	80 V
Reverse RecoveryTime trr (ns)	4 ns
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω	4
V(BR)R (V) Min @IR=100μA	80
Maximum Average Rectifier Current I_{O (mA)}	100 mA
Maximum Peak Forward Surge Current I_{FSM (A)}	2 A
Forward Voltage Drop V_F @ I_{F (mA)}	100, 0.94 mA
Maximum ReverseCurrent I_R(µA)	0.01 µA
TotalCapacitance C_T(pF)	0.5 pF
VF(V) Max @ IF=100mA	1
Maximum Reverse Current I_R @ V_{R (V)}	80 V
VF(V) Max @ IF=10mA	0.855
IR(uA) Max @ VR=80V	0.2
CT(pF) Max @ VR = 0V, f = 1MHz	2.5

Technical Documents

SPICE Model

DLLFSD01LP3.spice.txt

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2770	2025-10-30	2025-10-30	Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2461	2020-05-08	2021-04-05	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site