Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. PowerDI123
SURFACE MOUNT ZENER DIODE
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1.0W SURFACE MOUNT POWER ZENER DIODE POWERDI123
• 1W Power Dissipation on FR-4 PCB
• Large, Exposed Pad and Heat Sink Designed for Superior Thermal Performance
• Patented Interlocking Clip Design for High-Surge Capacity, US Patent #7,095,113
Compliance (Only Automotive Supports PPAP) |
Automotive |
|---|---|
AEC Qualified |
Yes |
Configuration |
Single |
Power Rating(mW) |
1000 |
Nom VZ (V) |
9.1 |
@ IZT (mA) |
50 mA |
Tol V (Typ) (%) |
5 % |
IR (µA) |
5 µA |
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A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2770 | 2025-10-30 | 2025-10-30 | Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products |
| PCN-2656 | 2023-12-20 | 2024-03-20 | Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness, and Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using Different Back Metal Composition and Thickness, PdCu Bond Wire, New Lead Frame, New Mold Compound Types for Select Automotive Products. |
| PCN-2462 | 2020-05-08 | 2021-04-11 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive) |
