Diodes Incorporated

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  • 1W Power Dissipation on FR-4 PCB
  • Lead-Free Finish; RoHS Compliant 
  • Halogen and Antimony Free. “Green” Device 
  • Qualified to AEC-Q101 Standards for High Reliability
  • Patented Interlocking Clip Design for High Surge Capacity,
  • US Patent #7,095,113

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Automotive
Configuration Single
Power Rating(mW) 1000
Nom VZ (V) 12
@ IZT (mA) 50 mA
Tol V (Typ) (%) 5 %
IR (µA) 3 µA

Related Content


Technical Documents

Recommended Soldering Techniques


Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2656 2023-12-20 2024-03-20 Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness, and Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using Different Back Metal Composition and Thickness, PdCu Bond Wire, New Lead Frame, New Mold Compound Types for Select Automotive Products.
PCN-2462 2020-05-08 2021-04-11 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)
PCN-2391 2019-05-24 2019-08-24 Clip Bond Structure, Lead Frame Type, and Mold Compound changes to enhance PowerDI-123 package