Description

The DDZxxXSF series offers Zener voltage tolerances of approximately 2% / Precise voltage regulation. Features 500mW power dissipation. Flat lead package design promotes efficient thermal transfer and high power dissipation capability. SOD323F surface mount package features a small footprint (1.7*1.25mm) and low-profile (0.7mm) design / Provides maximum space-savings, reduced customer PCB costs and is ideally suited for automated assembly. Available in a large selection of Zener voltages from 2.425V to 37.575V / Provides solutions for a wide variety of designs and applications. Economical, low cost package / Savings passed on to customer. Devices are lead-free/RoHs-compliant and green / Environmentally friendly, suitable for environmentally sensitive applications. Low reverse-leakage current, Low Zener impedance, Low capacitance / High performance for portable, battery-powered applications (low leakage current reduces the load on the battery, allowing for increased battery life), low capacitance desirable for high speed telecommunications and PC applications.

Application(s)

DC fans

Power Supplies

Voltage Regulation

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)	Standard
AEC Qualified	No
Configuration	Single
Power Rating(mW)	500
Nom V_{Z (V)}	33.64
@ I_{ZT (mA)}	5 mA
Tol V (Typ) (%)	2.53 %
I_{R (µA)}	0.07 µA

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2770	2025-10-30	2025-10-30	Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2691	2024-08-16	2024-11-14	Additional Wafer Sources and Transfer of Wafer Manufacturing Site for Select Discrete Products
PCN-2630	2024-02-20	2024-05-20	Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness for Select Products
PCN-2582	2022-05-17	2022-08-17	Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH)

DDZ36BSF