Diodes Incorporated
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DDZ36BSF

0.5W SURFACE MOUNT PRECISION ZENER DIODE

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Description

The DDZxxXSF series offers Zener voltage tolerances of approximately 2% / Precise voltage regulation. Features 500mW power dissipation. Flat lead package design promotes efficient thermal transfer and high power dissipation capability. SOD323F surface mount package features a small footprint (1.7*1.25mm) and low-profile (0.7mm) design / Provides maximum space-savings, reduced customer PCB costs and is ideally suited for automated assembly. Available in a large selection of Zener voltages from 2.425V to 37.575V / Provides solutions for a wide variety of designs and applications. Economical, low cost package / Savings passed on to customer. Devices are lead-free/RoHs-compliant and green / Environmentally friendly, suitable for environmentally sensitive applications. Low reverse-leakage current, Low Zener impedance, Low capacitance / High performance for portable, battery-powered applications (low leakage current reduces the load on the battery, allowing for increased battery life), low capacitance desirable for high speed telecommunications and PC applications.

Application(s)

  • DC fans
  • Power Supplies
  • Voltage Regulation
  • Product Specifications

    Product Parameters

    AEC Qualified No
    Compliance (Only Automotive supports PPAP) Standard
    Configuration Single
    Power Rating(mW) 500
    Nom VZ (V) 33.64
    @ IZT (mA) 5 mA
    Tol V (Typ) (%) 2.53 %
    IR (µA) 0.07 µA

    Related Content

    Packages

    Technical Documents

    Recommended Soldering Techniques

    TN1.pdf

    RoHS CofC

    Product Change Notices (PCNs)

    A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

    PCN # Issue Date Implementation Date Subject
    PCN-2630 2024-02-20 2024-05-20 Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness for Select
    Products
    PCN-2582 2022-05-17 2022-08-17 Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH)
    PCN-2315 2018-03-09 2018-06-09 Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility