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D3V3Z1BD2CSP

LOW CAPACITANCE BIDIRECTIONAL TVS DIODE

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Description

The D3V3Z1BD2CSP is an extremely low capacitance of 0.3 pF ESD protection device designed specifically to protect high-speed differential lines. These devices can also be used for EOS protection due to their high peak pulse current capability (10.5A, tP = 8/20µs). It has excellent ESD protection features, highlighted by low peak ESD clamping voltage and high ESD withstand voltage (+/-20kV contacts per IEC 61000-4-2). The small package DSN 0.60 x 0.30 x 0.30 gives designers the flexibility to protect a single line in applications.

Feature(s)

  • Provide Transient Protection for The Protected Line to

IEC 61000-4-2 (ESD) Air ±20kV, Contact ±20V

IEC 61000-4-5 (surge) 10.5A (8/20µs)

  • Bidirectional ESD Protection of One Line
  • Extremely Low Capacitance Cd = 0.3pF
  • Extremely Low Clamping Voltage to Protect Sensitive I/Os
  • Low Reverse Leakage Current: 50nA max at VR = 3.3V
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/

Application(s)

  • USB3.0, USB3.1, and USB3.2 Gen 2 x 2
  • USB Type-C®
  • HDMITM1.4, HDMITM 2.0 and HDMITM 2.1
  • ThunderboltTM 2, ThunderboltTM 3
  • 10G Ethernet
  • WiFi-6 AnT

Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) Standard
Maximum Peak Pulse Current IPP @ 8x20±s Max 10.5
AEC Qualified Yes
Configuration Single (Bi-Directional)
Channel Input CapacitanceCT Typ (pF) 0.3 pF
Reverse Standoff Voltage VRWM(V) 3.3 V
Breakdown VoltageVBR Min(V) 5 V
Typ Reverse Leakage Current IR @ VRWM Max(µA) 0.05 µA
Maximum Clamping Voltage @ MaxPeak Pulse CurrentVC(V) 5.3V@Ipp=10.5A V
VESD IEC61000-4-2 Contact Discharge(kV) ±20 kV

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf