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BC807-25

PNP, 45V, 0.5A, SOT23

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Product Specifications

Product Parameters

Qualified to AEC-Q10x Yes
Compliance (Only Automotive supports PPAP) On Request*
Product Type PNP
VCEO, VCES (V) 45 V
IC (A) 0.5 A
ICM (A) 1 A
PD (W) 0.31 W
hFE (min) 160 Min
hFE(@ IC) 0.1 A
hFE(Min 2) 100
hFE(@ IC2) 0.3 A
VCE (SAT)Max (mV) 700 mV
VCE (SAT) (@ IC/IB2) (A/m A) (A/m A) N/A
VCE (SAT)(Max.2) N/A mV
VCE (SAT) (@ IC/IB) (A/m A) 0.5/50
fT (MHz) 100 MHz
RCE(SAT) N/A mΩ

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
BC807-25

BC807-25

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Farnell, An Avnet Company 11974 9/28/2021 England Buy Now
Request Sample
BC807-25-7-F

BC807-25-7-F

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Avnet EU 75000 9/28/2021 Germany Buy Now
Arrow Electronics 2865 9/28/2021 United States Buy Now
Digi-Key Electronics 12012 9/28/2021 Europe, Asia, North America Buy Now
Mouser Electronics Inc. 4641 9/28/2021 South America, North America, Asia, Europe, Middle East Buy Now
Rutronik GmbH 9000 9/28/2021 Germany Buy Now
RS Components 1400 9/27/2021 England Buy Now
RS Components 6000 9/27/2021 England Buy Now
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BC807-25W-7

BC807-25W-7

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Arrow Electronics 2975 9/28/2021 United States Buy Now
Digi-Key Electronics 4147 9/28/2021 Europe, Asia, North America Buy Now
Mouser Electronics Inc. 30955 9/28/2021 South America, North America, Asia, Europe, Middle East Buy Now
RS Components 10500 9/27/2021 England Buy Now
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PCNs

Product Change Notices

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site