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Product Specifications

Product Parameters

Qualified to AEC-Q10x Yes
Compliance (Only Automotive supports PPAP) On Request
Configuration Dual, Com. Anode
Polarity Anode, Cathode
Power Rating (mW) 350 mW
ESD Diodes (Y|N) No Y/N
Peak RepetitiveReverse VoltageVRRM (V) 75 V
Reverse Recovery Time trr (ns) 4 ns
Maximum Average Rectifier Current IO (mA) 300 mA
Maximum Peak Forward Surge Current IFSM (A) 2 A
Forward Voltage Drop VF @ IF (mA) 0, 1 mA
Maximum ReverseCurrent IR (µA) 2.5 µA
Maximum Reverse Current IR @ VR (V) 75 V
V(BR)R (V) Min (µA) 75@2.5μA
TotalCapacitance CT (pF) 2 pF
VF(V) Max @ IF=1.0mA N/A
VF(V) Max @ IF=10mA 0.855
VF(V) Max @ IF=100mA 1
IR(nA) Max @ VR=5V N/A
IR(µA) Max @ VR=30V N/A
IR(uA) Max @ VR=80V 2.5μA@75V
CT(pF) Max @ VR = 0V, f = 1MHz 2
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω 4

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BAW56HDWQ-13

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BAW56Q-13-F

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PCNs

Product Change Notices

PCN # Issue Date Implementation Date Subject
PCN-2491 2020-11-17 2021-05-17 Device End of Life (EOL)
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2462 2020-05-08 2021-04-11 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)
PCN-2389 2019-02-05 2019-08-05 Device End of Life
PCN-2315 2018-03-09 2018-06-09 Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility
PCN-2319 2018-03-09 2018-06-09 Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility
PCN-2269 2017-04-21 2017-04-21 Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility