Diodes Incorporated
SOD123 3D image

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

Back to Inactve Datasheet Archive

BAV3004WQ (Not Recommended for new design)

NRND = Not Recommended for New Design


Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.


  • Low Leakage Current: ≤100nA
  • Fast Switching Speed: ≤50ns
  • High Reverse Breakdown Voltage: ≥350V
  • Ideal for Battery-Powered, Portable Applications
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • The BAV3004WQ is suitable for automotive applications requiring specific change control and is AEC-Q101 qualified, is PPAP capable, and is manufactured in IATF16949:2016 certified facilities.

Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) Automotive
Configuration Single
CT(pF) Max @ VR = 0V, f = 1MHz 5
ESD Diodes (Y|N) No
Forward Voltage Drop VF @ IF (mA) 1.25V @ 200
Maximum Average Rectifier Current IO (mA) 225
Maximum Peak Forward Surge Current IFSM (A) 4
Maximum ReverseCurrent IR (µA) 0.1
Maximum Reverse Current IR @ VR (V) 240
Peak RepetitiveReverse VoltageVRRM (V) 350
Polarity Cathode Bar
Power Rating(mW) 400
AEC Qualified Yes
Reverse RecoveryTime trr (ns) 50
TotalCapacitance CT (pF) 5
V(BR)R (V) Min (µA) 350
V(BR)R (V) Min @IR=100μA 350
VF(V) Max @ IF=100mA 1

Related Content


Technical Documents

Recommended Soldering Techniques



Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2614 2023-02-23 2023-08-23 Device End of Life (EOL) - Automotive
PCN-2545 2021-10-05 2022-01-05 Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products
PCN-2462 2020-05-08 2021-04-11 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)
PCN-2319 2018-03-09 2018-06-09 Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility