Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOD123F
SURFACE MOUNT LOW LEAKAGE DIODE
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Compliance (Only Automotive Supports PPAP) |
Automotive |
|---|---|
AEC Qualified |
Yes |
Configuration |
Single |
Polarity |
Cathode Bar; Anode, Cathode |
Power Rating(mW) |
375 mW |
ESD Diodes (Y|N) |
No |
Peak RepetitiveReverse VoltageVRRM (V) |
250 V |
Reverse RecoveryTime trr (ns) |
50 ns |
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω |
50 |
V(BR)R (V) Min @IR=100μA |
250 |
Maximum Average Rectifier Current IO (mA) |
200 mA |
Maximum Peak Forward Surge Current IFSM (A) |
9 A |
Forward Voltage Drop VF @ IF (mA) |
200 mA |
Maximum ReverseCurrent IR (µA) |
0.1 µA |
TotalCapacitance CT (pF) |
5 pF |
VF(V) Max @ IF=100mA |
1 |
Maximum Reverse Current IR @ VR (V) |
200 V |
CT(pF) Max @ VR = 0V, f = 1MHz |
5 |
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A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2770 | 2025-10-30 | 2025-10-30 | Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products |
| PCN-2545 | 2021-10-05 | 2022-01-05 | Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products |
| PCN-2462 | 2020-05-08 | 2021-04-11 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive) |
