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Ultra-small surface mount fast switching diode.


  • Mobile Phones
  • Portable and Consumer Electronics


  • Fast Switching Speed
  • Ultra-small Surface Mount Package (1.0 x 0.6 x 0.37mm)

Product Specifications

Product Parameters

Qualified to AECQ10x No
Automotive Compliant PPAP No
Configuration Single
Polarity Anode, Cathode
Power Rating 200 mW
ESD Diodes No Y/N
Peak Repetitive Reverse Voltage VRRM 75 V
Reverse Recovery Time trr 4 ns
Maximum Average Rectifier Current IO 150 mA
Maximum Peak Forward Surge Current IFSM 2 A
Forward Voltage Drop VF @ IF 1, 50 mA
Maximum Reverse Current IR 1 µA
Maximum Reverse Current IR @ VR 75 V
V(BR)R (V) Min @IR=100μA 75
Total Capacitance CT 2 pF
VF(V) Max @ IF=1.0mA N/A
VF(V) Max @ IF=10mA N/A
VF(V) Max @ IF=100mA 1.09
IR(nA) Max @ VR=5V N/A
IR(uA) Max @ VR=30V N/A
IR(uA) Max @ VR=80V 1μA@75V
CT(pF) Max @ VR = 0V, f = 1MHz 2
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω 4

Related Content

SOD923 (0.2mm Lead Width)


Technical Documents

Recommended Soldering Techniques


Orderable Part Number Authorized Distributor Quantity Inventory Date Buy Online Region
BAV16S92-7 Arrow Electronics 9950 8/8/2020 Buy Now United States
BAV16S92-7 Digi-Key Electronics 69402 8/8/2020 Buy Now United States
BAV16S92-7 Mouser Electronics Inc. 13813 8/8/2020 Buy Now United States
BAV16S92-7 Future Electronics - Europe 10000 8/7/2020 England
BAV16S92-7 RS Components 14600 8/7/2020 Buy Now England
BAV16S92-7 RS Components Ltd. 14600 8/7/2020 Buy Now Japan


Product Change Notices

PCN # Issue Date Subject
PCN-2461 2020-05-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2315 2018-03-09 Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility


Related Application FAQs