Diodes Incorporated
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BAT54SW

Schottky

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Feature(s)

  • Low Forward Voltage Drop
  • Fast Switching
  • Ultra-Small Surface Mount Package
  • PN Junction Guard Ring for Transient and ESD Protection
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • An Automotive-Compliant Part is Available Under Separate Datasheet (BAT54WQ /AWQ /CWQ /SWQ)

Application(s)

  • SMPS
  • DC-DC converters
  • Freewheeling diodes
  • Reverse polarity protections
  • Blocking diodes

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Standard
Configuration Dual, Series
Power Rating(mW) 200 mW
Peak RepetitiveReverse VoltageVRRM (V) 30 V
Forward Continuous Current IFM (mA) 200 mA
Forward VoltageDrop VF(V) 0.32
@ IF(mA) 1 mA
Maximum ReverseCurrent IR (µA) 2 µA
@ VR (V) 25 V
Capacitance CTOT Typ (pF) 10 pF

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2623 2023-05-15 2023-11-15 Device End of Life (EOL)
PCN-2562 2022-01-04 2022-04-04 Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2491 2020-11-17 2021-05-17 Device End of Life (EOL)
PCN-2477 2020-08-17 2021-05-09 Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2459 2020-05-28 2020-11-28 Device End of Life (EOL)
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2339 2018-06-15 2018-09-15 Qualification of Additional Wafer Source for Select Products