Diodes Incorporated — Analog and discrete power solutions
SMA

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMA

Back to B330AQ

B330AQ

3.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Description

 For use in low-voltage and high-frequency inverters, freewheeling, DC-DC converters, and polarity protection applications.

Feature(s)

  • Guard Ring Die Construction for Transient Protection
  • Ideally Suited for Automated Assembly
  • Low Power Loss, High Efficiency
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • The B320AQ-B360AQ is suitable for automotive applications requiring specific change control; this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities. https://www.diodes.com/quality/product-definitions/

Application(s)

For use in low-voltage and high-frequency inverters, freewheeling, DC-DC converters, and polarity protection applications.

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Automotive

AEC Qualified

Yes

Configuration

Single

MaximumAverageRectifiedCurrent IO (A)

3 A

Peak RepetitiveReverse VoltageVRRM (V)

30 V

Peak ForwardSurge CurrentIFSM(A)

80 A

Forward VoltageDrop VF(V)

0.5 V

@ IF (A)

3 A

Maximum ReverseCurrent IR (µA)

500 µA

@ VR (V)

30 V

TotalCapacitance CT (pF)

200 pF

Related Content

Packages

Applications

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availability

Something went wrong with your request. Please try again later. If this problem continues, please contact Diodes support for assistance.

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2590 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2500 2021-03-24 2021-06-24 Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for
Automotive Products
PCN-2478 2020-08-13 2021-06-06 Additional Wafer Source (GFAB)