Diodes Incorporated
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B270Q

2.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER

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Description

This Schottky Barrier Rectifier is designed to meet the general requirements of commercial applications. It is ideally suited for use as a: polarity protection diodes, re-circulating diodes, and switching diodes.

Feature(s)

  • Schottky Barrier Chip
  • Guard Ring Die Construction for Transient Protection
  • Low-Power Loss, High Efficiency
  • Surge Overload Rating to 50A Peak
  • For Use in Low-Voltage, High-Frequency Inverters, Free Wheeling, and Polarity Protection Application
  • High-Temperature Soldering: +260°C/10 Second at Terminal
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • The B270Q - B2100Q are suitable for automotive applications requiring specific change control; these parts are AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities. https://www.diodes.com/quality/product-definitions/

Application(s)

  • Polarity protection diodes
  • Re-circulating diodes
  • Switching diodes

Product Specifications

Product Parameters

@ IF (A) 2
@ TerminalTemperature TT (ºC) 125
@ VR (V) 70
Configuration Single
Forward VoltageDrop VF(V) 0.79
MaximumAverageRectifiedCurrent IO (A) 2
Maximum ReverseCurrent IR (µA) 7
Peak ForwardSurge CurrentIFSM(A) 50
Peak RepetitiveReverse VoltageVRRM (V) 70
Compliance (Only Automotive supports PPAP) Automotive
AEC Qualified Yes
Reverse RecoveryTime trr (ns) N/A
TotalCapacitance CT (pF) 75

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2590 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2500 2021-03-24 2021-06-24 Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for
Automotive Products
PCN-2478 2020-08-13 2021-06-06 Additional Wafer Source (GFAB)