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1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
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Compliance (Only Automotive Supports PPAP) |
Standard |
|---|---|
AEC Qualified |
Yes |
Configuration |
Single |
MaximumAverageRectifiedCurrent IO (A) |
1 A |
@ TerminalTemperature TT (ºC) |
130 ºC |
Peak RepetitiveReverse VoltageVRRM (V) |
60 V |
Peak ForwardSurge CurrentIFSM(A) |
30 A |
Forward VoltageDrop VF(V) |
0.7 V |
@ IF (A) |
1 A |
Maximum ReverseCurrent IR (µA) |
500 µA |
@ VR (V) |
60 V |
TotalCapacitance CT (pF) |
110 pF |
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A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2770 | 2025-10-30 | 2025-10-30 | Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products |
| PCN-2679 | 2024-04-01 | 2024-04-01 | Qualification of Additional Wafer Source for Select Discrete Products |
| PCN-2623 | 2023-05-15 | 2023-11-15 | Device End of Life (EOL) |
| PCN-2588 | 2022-06-01 | 2022-09-01 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products |
| PCN-2550 | 2021-12-20 | 2022-06-20 | Device End of Life (EOL) |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
