Diodes Incorporated — Analog and discrete power solutions
SOD123 3D image

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOD123

SOD123 3D image

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOD123

SOD123 3D image

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOD123

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B130LAW

Schottky

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Feature(s)

  • Guard Ring Die Construction for Transient Protection
  • Very Low Forward Voltage Drop
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP) Standard
AEC Qualified Yes
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 1 A
@ TerminalTemperature TT (ºC) N/A ºC
Peak RepetitiveReverse VoltageVRRM (V) 30 V
Peak ForwardSurge CurrentIFSM(A) 12 A
Forward VoltageDrop VF(V) 0.42 V
@ IF (A) 1 A
Maximum ReverseCurrent IR (µA) 1000 µA
@ VR (V) 30 V
TotalCapacitance CT (pF) 40 pF

Related Content

Packages

Technical Documents

SPICE Model

News

Recommended Soldering Techniques

TN1.pdf

Purchase & Availablity

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2690 2024-05-29 2024-08-29 Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products.
PCN-2623 2023-05-15 2023-11-15 Device End of Life (EOL)
PCN-2562 2022-01-04 2022-04-04 Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2477 2020-08-17 2021-05-09 Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi