Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOD123
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOD123
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOD123
Schottky
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| Compliance (Only Automotive Supports PPAP) | Standard |
|---|---|
| AEC Qualified | Yes |
| Configuration | Single |
| MaximumAverageRectifiedCurrent IO (A) | 1 A |
| @ TerminalTemperature TT (ºC) | N/A ºC |
| Peak RepetitiveReverse VoltageVRRM (V) | 30 V |
| Peak ForwardSurge CurrentIFSM(A) | 12 A |
| Forward VoltageDrop VF(V) | 0.42 V |
| @ IF (A) | 1 A |
| Maximum ReverseCurrent IR (µA) | 1000 µA |
| @ VR (V) | 30 V |
| TotalCapacitance CT (pF) | 40 pF |
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A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2690 | 2024-05-29 | 2024-08-29 | Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products. |
| PCN-2623 | 2023-05-15 | 2023-11-15 | Device End of Life (EOL) |
| PCN-2562 | 2022-01-04 | 2022-04-04 | Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
