Diodes Incorporated
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B0540WS

Schottky

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Feature(s)

  • Low Forward Voltage Drop
  • Guard Ring Construction for Transient Protection
  • High Conductance
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified
    facilities), please refer to the related automotive grade (Qsuffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability.
    https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 0.5 A
@ TerminalTemperature TT (ºC) N/A ºC
Peak RepetitiveReverse VoltageVRRM (V) 40 V
Peak ForwardSurge CurrentIFSM(A) 3 A
Forward VoltageDrop VF(V) 0.55 V
@ IF (A) 0.5 A
Maximum ReverseCurrent IR (µA) 5 µA
@ VR (V) 30 V
TotalCapacitance CT (pF) 125 pF

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2623 2023-05-15 2023-11-15 Device End of Life (EOL)
PCN-2562 2022-01-04 2022-04-04 Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2477 2020-08-17 2021-05-09 Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi