Diodes Incorporated — Analog and discrete power solutions
SMC

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

SMC.png
Back to Zener TVSs

3.0SMCJ15CA

3000W SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Feature(s)

  • 3000W Peak Pulse Power Dissipation
  • 5V to 170V Standoff Voltages
  • Uni-Directional and Bi-Directional
  • IEC-61000-4-2 ESD 30kV (Air), 30kV (Contact)
  • Human Body Model (HBM) 8kV; Charged Device Model (CDM) 1kV; Machine Model (MM) 800V
  • Glass Passivated Die Construction
  • Excellent Clamping Capability
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Standard
Configuration Single (Bi-Directional)
Power Rating (W) 3000 W
Reverse Standoff Voltage VRWM(V) 15 V
Breakdown VoltageVBR Min(V) 16.7 V
BreakdownVoltageVBR Max (V) 18.5 V
Maximum Reverse Leakage CurrentIR @ VRWM Max (µA) 5 µA
Maximum Clamping Voltage @ Max Peak Pulse Current VC (V) 24.2 V

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2701 2024-11-18 2025-02-17 Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products
PCN-2588 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products
PCN-2524 2021-10-04 2022-01-04 Wafer Diameter Change from 4 inch to 5 inch at Yea Shin Technology Co., Ltd. (Yeashin Fab) and Qualification of Yea Shin
Technology Co., Ltd. as Additional Wafer Source on Select Products