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3.0SMCJ13A

3000W SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR

Datasheet

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Feature(s)

3000W Peak Pulse Power Dissipation
5V to 170V Standoff Voltages
Uni-Directional and Bi-Directional
IEC-61000-4-2 ESD 30kV (Air), 30kV (Contact)
Human Body Model (HBM) 8kV; Charged Device Model (CDM) 1kV; Machine Model (MM) 800V
Glass Passivated Die Construction
Excellent Clamping Capability
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)	Standard
AEC Qualified	Yes
Configuration	Single (Uni-Directional)
Power Rating (W)	3000 W
Reverse Standoff Voltage V_RWM_(V)	13 V
Breakdown VoltageV_BR Min(V)	14.4 V
BreakdownVoltageV_BR Max (V)	15.9 V
Maximum Reverse Leakage CurrentI_R @ V_RWM Max (µA)	5 µA
Maximum Clamping Voltage @ Max Peak Pulse Current V_C _(V)	21.5 V

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2770	2025-10-30	2025-10-30	Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2701	2024-11-18	2025-02-17	Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products
PCN-2588	2022-06-01	2022-09-01	Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products