Diodes Incorporated — Analog and discrete power solutions
SMC

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3.0SMCJ11CA

3000W SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR

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Feature(s)

  • 3000W Peak Pulse Power Dissipation
  • 5V to 170V Standoff Voltages
  • Uni-Directional and Bi-Directional
  • IEC-61000-4-2 ESD 30kV (Air), 30kV (Contact)
  • Human Body Model (HBM) 8kV; Charged Device Model (CDM) 1kV; Machine Model (MM) 800V
  • Glass Passivated Die Construction
  • Excellent Clamping Capability
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Standard
Configuration Single (Bi-Directional)
Power Rating (W) 3000 W
Reverse Standoff Voltage VRWM(V) 11 V
Breakdown VoltageVBR Min(V) 12.2 V
BreakdownVoltageVBR Max (V) 13.5 V
Maximum Reverse Leakage CurrentIR @ VRWM Max (µA) 5 µA
Maximum Clamping Voltage @ Max Peak Pulse Current VC (V) 18.2 V

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2588 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products